Laser marking of silicon bricks

An innovative marking method for silicon bricks enables wafer manufacturers to trace back the single wafer accurately up to the corresponding silicon brick along the whole manufacturing process. The brick is marked with a newly designed bar code containing product information and a special code, that makes a trace back of the position of the single wafer within the brick possible. With a unique laser scanner technology, marking of silicon bricks may be realised up to 600 mm edge length for multi-chrystalline bricks and up to 1200 mm for mono-chrystalline bricks. 

To optimise the manufacturing process, we also offer laser marking on floor spaces of silicon bricks with data matrix codes.