Laser marking of Silicon Wafer

With the marking machine TL 2020-WM, the Dr. Teschauer AG is offering an optimal solution for the marking of mono- and multi-crystalline silicon wafer within the production process. Because of its compact design, an integration into existing production lines is easy to realise.

The wafer marking is realised while moving on the conveyor belt ( „On the Fly“). With this unique technique, a high capacity of 1 second per Wafer is guaranteed. After the marking, a process integrated code recognition is carried out „On the Fly“. An image recognition system to identify the position of the Wafer as well as a patented conveyor belt support the positioning of the marking and a smooth transportation of the wafer.