With automatic machinery for Wafer Cut Down, the Dr. Teschauer AG is providing a newly developped technology for the machining of silicon wafer. Damaged wafer (edge and angle blow-out) will be reprocessed from size 156 x 156 mm to size 125 x 125 mm or other. This reprocess is done automatically by laser scribing and following breakage of the scribed outline.  

With the help of this newly developped technology a higher wafer profit can be achieved.

Please contact us, if you need any further information.